N2 Purge EFEM

N2 Purge EFEM

Key Features

Sinfonia N2-EFEM — Contribution to Next Generation Technology

Equivalent Footprint to conventional EFEMs — Easy Drop in Replacements
EFEM Environment Monitors and Analysis:
- Dew Point, Differential Pressure, Oxygen Concentration, Temperature
- Real Time Data Monitoring
Auto-Teaching Option Simplifies Tool Setup and Reduce Down Time
Safety and Certifications
- Exchange of Environment
- S2, S8, CE Compliance (in progress)

Descriprtion

Extremely low Oxygen Level, ~100 ppm, can be achieved and maintained with minimal N2 Gas Consumption
Automatically Controlled Differential Pressure (of 10 ±3.5 Pa gage)

Category: Systems

Technical Data

Model: 3 Load Port Type

Functionality:

Applicable FOUP: 300mm N2 Purge Type FOUP (ENTEGRIS A300 & SPECTRA and other SEMI Standard N2 Purge Type FOUP)
Wafer Type: 300mm, Silicon

Dimensions & Weight

Dimensions: Width x Depth x Height: 2170mm x 1232mm x 2582mm
Weight: approx 1,800kg

Facilities

Power Supply: Single Phase 200~230VAC 50/60Hz, 15AMP
N2 Gas for EFEM Purge: Grade 5 or better, 600LPM, 0.6~0.7Pa gage
CDA for EFEM Purge: 600LPM, 0.6-0.7Pa gage
N2 Gas for LP Purge: Grade 5 or better, 200LPM/LP, 0.6~0.7Pa gage
Comp. N2 Gas for Drive: Grade 5 or better, 25LPM, 0.6~0.7Pa gage
Vacuum: 20LPM, Less than-70kPa gage
Exhaust for EFEM: 600LPM, -300–200Pa gage
FOUP Purge Outlet: 200LPM/LP, OPa gage

Performance

Oxygen Concentration: Less than 100ppm (Target: 30ppm)
Dew Point: Less than-50 Degrees Cesius
Cleanliness: ISO Class 1
Diff. Pressure: 10 ± 3.5Pa gage (when idle state)
Throughput: 200+ Wafer/Hour (LP -> Aligner -> LL -> LP)

Environment Monitoring System

Diff. Pressure Gauge, Oxygen Concentration Meter, Dew Point Meter, Temperature Meter, Atmospheric Pressure Controller

Options

Wafer Alignment, OHT Guard and Light Curtain, E84 Interface, Ionizer, Sealed Wafer Buffer Station, Chemical Filter, RFID Reader for Load Ports, Signal Tower, Monitor & Keyboard, etc.

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