Technical Data

Model: Stand Alone

Functionality:

• Carrying Object: SEMI standard 200 to 800 mm wafer (Transparent, translucent, silicon)
• Positioning Time: Centering: 3 sec (Wafer pick-up/placing time excluded)
• Positioning Accuracy: Centering: Within ±0.1 mm, Flat locating/Notch locating: Within ±0.1 deg
• Sensor: LED light + wafer edge detection with image sensor unit
• Wafer Size Change: By command control or switch
• Cleanliness: ISO Class 2 (at wafer transfer level when exhausting driving part)
• Driving Method: 2-phase stepping motor (for 3 axes), Internal motor driver, controller
• Utility: Power: DC24V±10% 3A, Vacuum: -53 kPa or more