Key Features
Sinfonia N2-EFEM — Contribution to Next Generation Technology
- Equivalent Footprint to conventional EFEMs — Easy Drop in Replacements
- EFEM Environment Monitors and Analysis:
- Dew Point, Differential Pressure, Oxygen Concentration, Temperature
- Real Time Data Monitoring
- Auto-Teaching Option Simplifies Tool Setup and Reduce Down Time
- Safety and Certifications
- Exchange of Environment
- S2, S8, CE Compliance (in progress)
Descriprtion
- Extremely low Oxygen Level, ~100 ppm, can be achieved and maintained with minimal N2 Gas Consumption
- Automatically Controlled Differential Pressure (of 10 ±3.5 Pa gage)
Technical Data
Model: 3 Load Port Type
Functionality:
- Applicable FOUP: 300mm N2 Purge Type FOUP (ENTEGRIS A300 & SPECTRA and other SEMI Standard N2 Purge Type FOUP)
- Wafer Type: 300mm, Silicon
Dimensions & Weight
- Dimensions: Width x Depth x Height: 2170mm x 1232mm x 2582mm
- Weight: approx 1,800kg
Facilities
- Power Supply: Single Phase 200~230VAC 50/60Hz, 15AMP
- N2 Gas for EFEM Purge: Grade 5 or better, 600LPM, 0.6~0.7Pa gage
- CDA for EFEM Purge: 600LPM, 0.6-0.7Pa gage
- N2 Gas for LP Purge: Grade 5 or better, 200LPM/LP, 0.6~0.7Pa gage
- Comp. N2 Gas for Drive: Grade 5 or better, 25LPM, 0.6~0.7Pa gage
- Vacuum: 20LPM, Less than-70kPa gage
- Exhaust for EFEM: 600LPM, -300--200Pa gage
- FOUP Purge Outlet: 200LPM/LP, OPa gage
Performance
- Oxygen Concentration: Less than 100ppm (Target: 30ppm)
- Dew Point: Less than-50 Degrees Cesius
- Cleanliness: ISO Class 1
- Diff. Pressure: 10 ± 3.5Pa gage (when idle state)
- Throughput: 200+ Wafer/Hour (LP -> Aligner -> LL -> LP)
Environment Monitoring System
- Diff. Pressure Gauge, Oxygen Concentration Meter, Dew Point Meter, Temperature Meter, Atmospheric Pressure Controller
Options
- Wafer Alignment, OHT Guard and Light Curtain, E84 Interface, Ionizer, Sealed Wafer Buffer Station, Chemical Filter, RFID Reader for Load Ports, Signal Tower, Monitor & Keyboard, etc.
No request information available.
