Key Features
Contribution to further miniaturization (Xnm)
- Extremley smooth motion due to hybrid (Electric/Pneumatic) FOUP door Open/Close mechanism
- N2 Purge field upgrade option
- Applicable for high sealed FOUPs
- Fast and accurate mapping technology; applicable for thin wafers
Description
- Compatible with all SEMI compliant FOUPs
- User friendly and functional due to large indicators with selectable FAB-specific configurations
- Reliably working in most of 300mm FABs all over the world with abundant supply reference
- Superior cleanliness due to original design preventing particles from penetrating the FOUP
- Corrosion resistant model available
- Compliant with SEMI, CE and FAB requirements
- Fast and accurate mapping technology (Wafer Presence, Double, Cross detection)
- Thin wafer mapping capability
- Easy to integrate and maintain
Technical Data
Model: SELOP-8
Functionality:
- Carrier Types:
- 300mm FOUP (Front Opening Unified Pod) in conformity with SEMI standard
- FOUP Sensors: presence, placement, door presence
- Wafer Sensors: mapping, protrusion
- Safety Sensor: Hand
- Status Functions:
- Door up/down, open/close
- Wafer Mapping: Stepping Motor/Timing Belt
- Clamp, Dock, Latch Key: Air Cylinder
- Door Holding:
- Vacuum absorption method
- Standard Features:
- Wafer mapping, undock position adjustment (for OHT)
- BOLTS surface position adjustment mechanism
- Self-standing caster
- FOSB (Front Opening Shipping Box) compliance
Dimensions & Weight:
- Dimensions: Width: 470mm; Depth: 547mm; Height: 1373mm
- Weight: 65kg (Standard Specification)
Facilities:
- Communication: RS232 / Ethernet
- Air: 0.45-0.6MPa; 20NL/min.
- Vacuum: -40KPa (-60KPa); 5NL/min.
- Electricity: DC24V 5A (7A); Optional AC200V
Performance:
- Speed:
- 12 sec. for FOUP opening with mapping
- 9 sec. for FOUP closing without mapping
- Reliability: MCBF (Mean Cycles Between Failures): 1,000,000
- Cleanliness: CLASS 1
- Positioning Accuracy: ±0.1mm on FOUP front/rear axis and on FOUP up/down axis
Options:
- Customizable: Indicator Panel and Switch Panel
Features:
- Carrier ID reader, Infopad (Hard Pin / Sensor Type A, B, C, D), PIO
- Applicable to Quartz Wafer (excluding mapping function)
- Applicable to AC200V, E84, E84-CID communication
- Sealing of BOLTS surface, exhaust fan, corrosion resistance, N2 purge
No request information available.
